HK StockDetailed Quotes

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BIREN TECH

37.740

+2.4206.85%

Volume:11.18M

Turnover:419.19M

Market Cap:97.82B

PE:-4.33

High:38.380

Open:35.380

Low:35.260

Close:35.320

52wk High:70.750

52wk Low:27.320

Shares:2.59B

HK Float Shares:1.35B

Volume Ratio:0.97

T/O Rate:0.83%

Dividend:- -

Dividend Rate:- -

EPS(LYR):-8.720

ROE:--

ROA:-14.59%

PB:-3.52

PE(LYR):-4.33

PS:81.03

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Overview Company News Filings

Chinese Tech Firms, from Apple Suppliers to Openai Rivals, Raise $20 Billion in Hong Kong

Movement Alert｜Biren Technology Rises 3.82% in Regular Trading, Stock Extends Rebound Above HK$7 Billion Placement Price

HK Movers | Chip Stocks Jump With Smart Core up 15%; GigaDevice up 9%; Montage Technology up 7%

Tiger Newspress

Movement Alert｜Biren Technology Rises 3.21% in Regular Trading, Extending Rebound After Completing HK$7 Billion Share Placement

Hong Kong Market Stands Firm Amid Global Turmoil; Domestic Substitution Accelerates on Catalysts

Biren Technology Raises Over HK$7 Billion from Share Placement

MT Newswires Live

Biren Tech raises HK$7.04 billion via H-share placement; issued capital expands to 2.59 billion shares

Bulletin Express

Biren Technology Unveils Revised Articles of Association, Setting Out Post-IPO Share Structure, Governance Framework and Dividend Policy

Bulletin Express

Shanghai Biren Completes Hk$7.07 Billion H-share Placement at Hk$46.2 Each

Hong Kong Market Midday Report: Hang Seng Index Gains 2.38%, Domestic Chip Stocks Surge

Puhua Capital-backed Ruivi Technology Lists in Hong Kong, Shares Trade as 07656.hk

Movement Alert｜Biren Technology Rises 4.39% in Regular Trading, Extending Rebound After Discounted Share Placement

Chip Stocks Jump With SHANGHAI FUDAN up 10%; HUA HONG GRACE up 6%; SMIC, BIREN TECH up 4%

Tiger Newspress

Movement Alert｜Biren Technology Rises 3.01% in Regular Trading, Rebounding from Low After Discounted Share Placement Triggered Prior Session Sell-off

Biren Technology Seeks HK$7 Billion via Share Placement

MT Newswires Live

Movement Alert｜Biren Technology Falls 9.36% in Regular Trading, Pressured by Discounted Placement of 153 Million New H Shares

BIREN TECH to Raise HK$7.04 Billion Through 153 Million New H-Share Placement at 9.94% Discount

Bulletin Express

Shanghai Biren Places 153,000,000 New H Shares at HK$ 46.2 Each in Private Placement

Chinese Chip Firm Biren Tech Seeks up to $838 Million in Hong Kong Placement, Term Sheet Shows

Shanghai Biren Technology Plans to Raise About $801 Million to $838 Million Through a New Share Placement in Hong Kong, Term Sheet Shows

THOMSON REUTERS

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The company issued 153.00 million new H shares at...","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["06082"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1196699562","title":"Biren Technology Unveils Revised Articles of Association, Setting Out Post-IPO Share Structure, Governance Framework and Dividend Policy","url":"https://stock-news.laohu8.com/highlight/detail?id=1196699562","media":"Bulletin Express","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1196699562?lang=en_us&edition=fundamental","pubTime":"2026-07-08 17:43","pubTimestamp":1783503816,"startTime":"0","endTime":"0","summary":"Shanghai Biren Technology Co., Ltd. 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The stock continued its low-level rebound for a second consecutive session after...","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["06082"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1120113582","title":"Chip Stocks Jump With SHANGHAI FUDAN up 10%; HUA HONG GRACE up 6%; SMIC, BIREN TECH up 4%","url":"https://stock-news.laohu8.com/highlight/detail?id=1120113582","media":"Tiger Newspress","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1120113582?lang=en_us&edition=fundamental","pubTime":"2026-07-08 09:40","pubTimestamp":1783474824,"startTime":"0","endTime":"0","summary":"Chip stocks jumped in market trading. $SHANGHAI FUDAN(01385)$ rose 10%; $HUA HONG GRACE(01347)$ rose 6%; $SMIC(00981)$, $BIREN TECH(06082)$ rose 4%; $INNOSCIENCE(02577)$ rose 1%.","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["01347","00981","01385","06082","SOXL","02577"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1176072327","title":"Movement Alert｜Biren Technology Rises 3.01% in Regular Trading, Rebounding from Low After Discounted Share Placement Triggered Prior Session Sell-off","url":"https://stock-news.laohu8.com/highlight/detail?id=1176072327","media":"Market Focus","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1176072327?lang=en_us&edition=fundamental","pubTime":"2026-07-07 09:59","pubTimestamp":1783389553,"startTime":"0","endTime":"0","summary":"On July 7, Biren Technology rose 3.01% in regular trading, trading at HK$48.64/share with turnover of HK$249 million. The stock is rebounding from the previous session's 9.36% decline triggered by...","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["06082"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2649617064","title":"Biren Technology Seeks HK$7 Billion via Share Placement","url":"https://stock-news.laohu8.com/highlight/detail?id=2649617064","media":"MT Newswires Live","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2649617064?lang=en_us&edition=fundamental","pubTime":"2026-07-06 10:38","pubTimestamp":1783305491,"startTime":"0","endTime":"0","summary":"Shanghai Biren Technology  is looking to raise HK$7.07 billion via a share placement, according to a Hong Kong bourse filing Sunday.The company is seeking investors for 153 million H shares priced at HK$46.20 each to raise funds to accelerate the commercialization of Biren's products.The shares represent 6.27% of the company's issued share capital, and 5.90% as enlarged by the sale.","market":"sg","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.mtnewswires.com/","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"mtnewswires_news","symbols":["BK1163","06082"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1153074079","title":"Movement Alert｜Biren Technology Falls 9.36% in Regular Trading, Pressured by Discounted Placement of 153 Million New H Shares","url":"https://stock-news.laohu8.com/highlight/detail?id=1153074079","media":"Market Focus","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1153074079?lang=en_us&edition=fundamental","pubTime":"2026-07-06 09:34","pubTimestamp":1783301660,"startTime":"0","endTime":"0","summary":"On July 6, Biren Technology fell 9.36% in regular trading, trading at HK$49.50/share, with turnover of HK$189 million.On the news front, the company announced on July 5 that it entered into a placing...","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["06082"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1187940418","title":"BIREN TECH to Raise HK$7.04 Billion Through 153 Million New H-Share Placement at 9.94% Discount","url":"https://stock-news.laohu8.com/highlight/detail?id=1187940418","media":"Bulletin Express","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1187940418?lang=en_us&edition=fundamental","pubTime":"2026-07-05 18:48","pubTimestamp":1783248534,"startTime":"0","endTime":"0","summary":"Shanghai Biren Technology Co., Ltd. (BIREN TECH, 06082) has signed a placing agreement with China International Capital Corporation Hong Kong Securities and CLSA to issue 153.00 million new H shares...","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["06082"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2649261330","title":"Shanghai Biren Places 153,000,000 New H Shares at HK$ 46.2 Each in Private Placement","url":"https://stock-news.laohu8.com/highlight/detail?id=2649261330","media":"Reuters","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2649261330?lang=en_us&edition=fundamental","pubTime":"2026-07-05 18:45","pubTimestamp":1783248311,"startTime":"0","endTime":"0","summary":"Shanghai Biren places 153,000,000 new H shares at HK$ 46.2 each in private placementShanghai Biren priced a best-efforts placing of 153,000,000 new H shares at HK$ 46.2 each, raising gross proceeds of","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20260705:nNDL7WSfyJ:1","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK1163","06082"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2648661807","title":"Chinese Chip Firm Biren Tech Seeks up to $838 Million in Hong Kong Placement, Term Sheet Shows","url":"https://stock-news.laohu8.com/highlight/detail?id=2648661807","media":"Reuters","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648661807?lang=en_us&edition=fundamental","pubTime":"2026-07-03 22:00","pubTimestamp":1783087235,"startTime":"0","endTime":"0","summary":"Chinese chip firm Biren Tech seeks up to $838 million in Hong Kong placement, term sheet showsSINGAPORE, July 3 -Chinese fabless semiconductor design company, Shanghai Biren Technology6082.HK, plans to raise about $801 million to $838 million through a new share placement in Hong Kong, according to a term sheet seen on Friday night.","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20260703:nL4N4350RL:1","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["06082","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2648066188","title":"Shanghai Biren Technology Plans to Raise About $801 Million to $838 Million Through a New Share Placement in Hong Kong, Term Sheet Shows","url":"https://stock-news.laohu8.com/highlight/detail?id=2648066188","media":"THOMSON REUTERS","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648066188?lang=en_us&edition=fundamental","pubTime":"2026-07-03 22:00","pubTimestamp":1783087235,"startTime":"0","endTime":"0","summary":null,"market":"nz","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20260703:nL4N4350RL:1","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"reuters_en_live","symbols":["BK1163","06082"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":10,"pageCount":4,"totalSize":200,"code":"91000000","status":"200"}]}}