Powertech Technology Discloses Financing Details of Singapore Venture; Shares Surge 10%

MT Newswires
Aug 10

Powertech Technology (TPE:6239) said its advanced packaging joint venture with Broadcom in Singapore, XCIP Technologies, will carry a total investment of $5.66 billion, with the company contributing $400 million for a 30% stake.

The chip packaging and testing company could inject cash in instalments from internal funds, according to a Friday filing with the Taiwan Exchange.

Shares of the company surged nearly 10% in Monday trading.

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