Taiwan Semiconductor Manufacturing (TSM) earmarked an additional $100 billion to increase its chipmaking capacity in the US, raising its total planned investment to $265 billion, Bloomberg reported Thursday, citing a US official.
The official told Bloomberg that the additional investment will be used to construct four chip plants that will increase the number of the company's US facilities to 10 fabrication plants and two packaging facilities.
Taiwan Semiconductor Manufacturing did not immediately respond to MT Newswires' request for a comment.
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