Shenwan Hongyuan Raises 6 Billion Yuan Via Bond Issue

MT Newswires Live
Jun 29

Shenwan Hongyuan (SHE:000166, HKG:6806) raised 6 billion yuan via the issue of two tranches of corporate bonds.

The offering comprises 1.4 billion yuan of 175-day bonds at a 1.52% coupon rate and 4.6 billion yuan of 365-day bonds at a 1.55% rate, according to a weekend filing with the Shenzhen bourse.

Shares of the securities company were up 2% on the Hong Kong bourse and 1% in Shenzhen.

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