ASE Technology (ASX) subsidiary Advanced Semiconductor Engineering has launched an automated 310mm panel-level packaging production line, which enables the seamless transition from wafer-level packaging to panel-level packaging, the company said Tuesday.
The new panel line is expected to start production in H1 of 2027, the company said.
The larger panel format supports higher throughput and reduced cycle time, according to a statement.
The company's shares were up 11% in premarket activity.
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