On May 27, ASE Technology rose 3.98% overnight, trading at 40.61 USD/share, with trading volume of approximately $17,000.

On the news front, AMD announced an investment of over $10 billion into Taiwan's semiconductor and AI industry ecosystem. As a core OSAT (outsourced semiconductor assembly and test) partner, ASE Technology will co-develop next-generation 2.5D bridge interconnect technology with AMD, directly benefiting from capacity expansion and order expectations driven by this large-scale investment. Additionally, ASE's subsidiary unveiled an automated 310mm panel-level packaging production line, expected to commence production in the first half of next year, further expanding the company's advanced packaging growth potential.

The company's fundamentals remain solid, with OSAT service prices raised 5% to 20%, advanced packaging revenue targets upgraded to $3.5 billion, and active capacity expansion in AI and high-performance computing. Within the Semiconductors sector, Micron Technology rose 4.87%, AMD rose 1.3%, and Broadcom rose 0.24%, reflecting continued sector recovery.

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