On June 17, Amkor Technology rose 6.19% in pre-market trading, trading at $92.08/share, with turnover of $1.5476 million.

On the news front, TSMC and Amkor Technology announced a 10-year strategic partnership agreement to jointly expand advanced semiconductor packaging capacity in Arizona, USA, strengthening the domestic semiconductor supply chain. Under the agreement, Amkor will provide long-term advanced packaging and testing services to TSMC, supporting high-performance computing and AI chip mass production demands. Amkor is advancing construction of its advanced packaging and testing campus in Arizona, while TSMC is simultaneously building its wafer fabrication facilities in the same region, creating an integrated industrial synergy loop.

Amkor Technology is headquartered in Tempe, Arizona, and provides outsourced semiconductor packaging and test services globally. The company serves integrated device manufacturers, fabless semiconductor companies, and contract foundries with turnkey packaging solutions including wafer bump, package design, system-level testing, and advanced system-in-package modules for applications spanning AI, mobile devices, automotive, and networking.

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