During the 2026 World Robot Conference (WRC 2026), UBTECH Robotics and Shenzhen Basic Semiconductor Co., Ltd. officially signed a strategic cooperation agreement. The partnership leverages UBTECH's technological and mass-production strengths in embodied intelligence humanoid robots, combined with Basic Semiconductor's core expertise and industrialization capabilities in silicon carbide (SiC) power devices.

The collaboration focuses on optimizing energy efficiency in humanoid robots and developing low-power, high-endurance products. Both companies aim to accelerate the large-scale application of SiC power devices within the embodied intelligence robotics sector. UBTECH brings deep experience in embodied intelligence robot R&D and scenario deployment, alongside strong industry insights and application trend forecasting. Basic Semiconductor maintains full independent control over the entire SiC industry chain, covering chip design, wafer fabrication, packaging and testing, as well as driver applications, with core offerings including SiC MOSFETs, automotive-grade and industrial-grade power modules.

Under this agreement, the two parties will conduct joint research and validation on the use of SiC power devices across multiple modules, such as robot power management and motion control. The initiative aims to promote the widespread adoption of these components in embodied intelligence humanoid robots, fostering the development of new quality productive forces.