According to the latest wafer foundry industry research from TrendForce, the global supply and demand landscape for mature semiconductor process nodes is undergoing a transformation. Not only have 8-inch capacity utilization rates and foundry prices stopped falling and begun to rise, but the 12-inch mature node segment is also expected to see order shifts driven by TSMC's planned production cuts. Furthermore, some foundries are reallocating capacity for 90nm and above High Voltage processes to power-related orders, benefiting supply chains in mainland China, with an atmosphere of price increases gradually appearing. Since the second half of 2025, production cuts in 8-inch capacity by major players TSMC and Samsung Foundry, coupled with growing power management and power requirements from AI servers, general-purpose servers, and Edge AI, have led to the average 8-inch capacity utilization rate among the world's top ten foundries rebounding to nearly 90% in 2026, a significant improvement from the nearly 80% seen in 2025. These foundries have successfully passed on price increases to their customers. TrendForce anticipates that global 8-inch capacity will maintain a negative growth trend until the first half of 2027. Products such as PMICs and Power Discretes, which primarily use 8-inch processes, will support an average capacity utilization rate above 80% for the top ten foundries. In the 12-inch mature process segment, approximately 70% of current capacity expansion activities are being driven by mainland Chinese foundries, while expansion in other regions is relatively modest. Observing medium to long-term supply and demand dynamics, the trend of supply chain diversification continues. Combined with the rapid growth in power demand related to AI GPUs/XPUs, wafer consumption for 90nm and above mature processes is increasing. Foundries, considering the better Average Selling Price and profitability of power management-related products, are gradually shifting capacity from DDIC and CIS production to PMIC/BCD and Power Discrete manufacturing. Due to some foundries reallocating capacity and raising prices, clients for HV processes and CIS, seeking price and capacity stability, are shifting their products and production to mainland Chinese foundries. This order transfer effect began to appear in the second half of 2025, driving growth in 90nm and above 12-inch orders for mainland Chinese manufacturers. For instance, Nexchip, which primarily produces mid-to-low-end DDIC and CIS, is already experiencing supply shortages. TSMC's planned production cuts will become another key factor influencing the 12-inch mature process supply landscape. TrendForce indicates that TSMC, considering that advanced process customers still require mature process capacity for peripheral ICs and the need for existing customers to manage product end-of-life cycles or find new foundry partners, will implement production cuts gradually over the next one to three years. However, during the period when TSMC is reconfiguring its 12-inch mature process capacity, notifying customers of impending cuts, and before the authorized capacity from VSMC is fully operational, customers are also seeking support for existing products and capacity from other partner foundries, such as UMC, which has received a small number of additional orders. Although the 12-inch mature process segment is not currently facing severe shortages, it is possible that medium to long-term order spillover from TSMC could prompt Tier 2 foundries to signal renewed price hike intentions to customers in the second half of 2026. Furthermore, considering that requalifying products for production takes nearly a year, TrendForce expects the contribution of transferred orders from TSMC's mature processes to Tier 2 foundry capacity will become more significant after the second half of 2027.